JOB POSTING INFORMATION
Position Type:	Professional Experience Year Co-op (PEY Co-op: 12-16 months)
Job Title:	PEY - Thermal/Mechanical, Xe Platform Engineering Team
Job Location:	250 Ferrand Drive
Job Location Type:	On-Site
If working on site, can you provide a copy of your COVID-19 safety protocols?:	Yes
Number of Positions:	1
Salary:	Salary Not Available, 37.5 hours per week
Start Date:	05/01/2024
End Date:	08/30/2025
Job Function:	Engineering
Job Description:	Are you passionate about computer graphics? Working with leading engineers on Intel's latest GPU architecture? Now is the time to make your education count and work at Intel. As a PEY student, you can contribute to Intel’s technology innovation. At Intel, we have a dynamic work environment with a team of experts and unique opportunities for your career development. You can enjoy your work at Intel with managers and colleagues who are eager to mentor you and help you to grow.   About the Department The thermal mechanical group is part of the Xe Platform Engineering team and is responsible for thermal, mechanical, and acoustic design of discrete graphics cards. The team is an essential part of delivering Intel's 3D graphics, media, display GPU, and Parallel Computing Technology.   Job Purpose This position entails thermal, mechanical, and acoustic testing of graphics cards, as well as elements of thermal and mechanical design.    Key Responsibilities Mechanical, thermal, and acoustic testing of graphics cards Building/de-bugging computer systems and test setups Preparing test reports and documenting thermal-mechanical specifications Vendor management and communication Data presentation including analysis and recommendation to larger team Developing scripts to automate data processing and test reports Design of test fixtures
Job Requirements:	Skills and Experience Requirements Lab skills including test setup preparation and data acquisition applicable to computer systems Data analysis including experience working with programming languages in Excel 3D modeling and mechanical design skills using Creo (at a minimum a good working knowledge of SolidWorks is required) Good written and oral communication skills Comfortable working within a team atmosphere as well as independently   What You Will Learn Thermal, mechanical, acoustic design/test principles for discrete graphics cards Product design considering all engineering aspects (cost, project timeline, etc.)   Ways to Stand Out Above the Crowd Applicable work/experience in a lab environment A computer enthusiast with knowledge of PC technology Experience in discrete graphics add-in cards/systems and building your own PC Experience in thermal or mechanical simulation Decent knowledge of basic control systems Programming/Scripting languages such as C, C++, Perl, Python
Preferred Disciplines:	Chemical Engineering Computer Engineering Electrical Engineering Engineering Science (Electrical and Computer) Industrial Engineering Materials Engineering Mechanical Engineering
All Co-op programs:	No
Targeted Co-op Programs:	Targeted Programs Professional Experience Year Co-op (12 - 16 months)

APPLICATION INFORMATION
Application Deadline:	Oct 15, 2023 11:59 PM
Application Receipt Procedure:	Online via system
U of T Job Coordinator:	Kaisa Moran

ORGANIZATION INFORMATION
Organization:	Intel Canada
Division:	Don Valley North

ADDITIONAL INFORMATION
Length of Workterm:	FIXED PEY Co-op: 16 months